Iwata gets technical, with U
The latest edition of Iwata Asks on the Nintendo website gets all technical, with Satoru Iwata interviewing a group of boffins about how various aspects of the Wii U hardware came together. In the room were:
Here are some pics that resulted from the interview:
Multi Chip Module.
Wii U motherboard.
Graphics Processing Unit and Central Processing Unit.
Heat sink - for dissipating heat.
Fan - for cooling.
Vent - allows air out.
The heat sink and fan positioning.
A transparent Wii U console.
Air flow through the Wii U.
A plastic shield for the heat sink.
Wii U Deluxe front panel.
Wii U and Wii case comparison.
You're keen to post a comment, but you need to log in first.
Wii's World has teamed up with Enjoy Gaming to give you a chance to win download codes for three of their new games on DSiWare. You could win a code for one of the following:
** Entrants must be in an NoA region (USA, Canada, Mexico or Brazil) **
The Legend of Zelda: A Link Between Worlds review
A bright future for the beloved franchise.
Blaster Master Overdrive review
Blast away while you can.
Spot the Differences: Party! review
Is this game different enough from the rest?
10-in-1: Arcade Collection review
A reminder that there is something to be said for name brands...
Interview with IronFall developers VD-dev
Start your engines
Wii's World is not officially affiliated with Nintendo! (but they wish we were).