Iwata gets technical, with U
The latest edition of Iwata Asks on the Nintendo website gets all technical, with Satoru Iwata interviewing a group of boffins about how various aspects of the Wii U hardware came together. In the room were:
Here are some pics that resulted from the interview:
Multi Chip Module.
Wii U motherboard.
Graphics Processing Unit and Central Processing Unit.
Heat sink - for dissipating heat.
Fan - for cooling.
Vent - allows air out.
The heat sink and fan positioning.
A transparent Wii U console.
Air flow through the Wii U.
A plastic shield for the heat sink.
Wii U Deluxe front panel.
Wii U and Wii case comparison.
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gw117 said:
The download link doesn't work... ...
robcfg said:
I worked with those some years ago, and they are basically identical to the home unit, but it needed special recordable ...
samsopil1234 said:
Asia
... 50 Classic Games 3D
cocotg said:
cocotg* ... Cocoto Magic Circus 2
FellaHaterPeP said:
because they stink of poop
... Super Mario Odyssey
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User comments
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danfango said:
Good stuff. Nintendo has a great track record of building robust hardware so I'm not expecting any RRODs or similar.
1 decade ago