Iwata gets technical, with U
The latest edition of Iwata Asks on the Nintendo website gets all technical, with Satoru Iwata interviewing a group of boffins about how various aspects of the Wii U hardware came together. In the room were:
Here are some pics that resulted from the interview:
Multi Chip Module.
Wii U motherboard.
Graphics Processing Unit and Central Processing Unit.
Heat sink - for dissipating heat.
Fan - for cooling.
Vent - allows air out.
The heat sink and fan positioning.
A transparent Wii U console.
Air flow through the Wii U.
A plastic shield for the heat sink.
Wii U Deluxe front panel.
Wii U and Wii case comparison.
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It's about time things came good. ... The Best Upcoming Wii U Games For The Spring and Summer
Nice update. I'm really looking forward to NES Remix 2. With a little bit of 3rd party support, great indie support a ... The Best Upcoming Wii U Games For The Spring and Summer
Danny Stueber said:
no problem! the point is to get the word out and that is what happened :) ... Super Smash Bros. For 3DS and WII U Release Window Revealed Along With New Modes and Characters
Alex Morton said:
Seems like we both posted the same story. My apologies. I was rushing so much to write it up and post it that I didn't ... Super Smash Bros. For 3DS and WII U Release Window Revealed Along With New Modes and Characters
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